The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8192837 B1

Date of Patent:

Jun. 05, 2012

Filed:

Dec. 17, 2008

Adhesive layer composition for in-mold decoration

Applicants:

Xiaojia Wang, Fremont, CA (US);

Cheri Pereria, Fremont, CA (US);

Pei-lin Wang, San Jose, CA (US);

Jing-den Chen, San Jose, CA (US);

Rong-chang Liang, Cupertino, CA (US);

Inventors:

Xiaojia Wang, Fremont, CA (US);

Cheri Pereria, Fremont, CA (US);

Pei-Lin Wang, San Jose, CA (US);

Jing-Den Chen, San Jose, CA (US);

Rong-Chang Liang, Cupertino, CA (US);

Assignee:

Etansi Inc., Taoyuan County, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Patrick Niland

Int. Cl.

CPC ...

A01K 1/015 (2006.01); B28B 7/22 (2006.01); B28B 7/36 (2006.01); B28B 7/38 (2006.01); B32B 5/16 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B41B 11/54 (2006.01); B29C 33/56 (2006.01); B29C 41/32 (2006.01); B29C 45/14 (2006.01); B60C 1/00 (2006.01); C04B 28/14 (2006.01); C08F 8/00 (2006.01); C08F 8/30 (2006.01); C08F 283/04 (2006.01); C08F 290/04 (2006.01); C08G 18/08 (2006.01); C08G 63/48 (2006.01); C08G 63/91 (2006.01); C08J 3/02 (2006.01); C08K 3/20 (2006.01); C08K 3/26 (2006.01); C08K 3/30 (2006.01); C08K 3/34 (2006.01); C08K 3/40 (2006.01); C08K 9/00 (2006.01); C08K 9/04 (2006.01); C08L 51/00 (2006.01); C08L 75/00 (2006.01); C08L 83/00 (2006.01); C09B 67/00 (2006.01); C09C 1/42 (2006.01); C09D 5/02 (2006.01); C09D 17/00 (2006.01); C09K 19/00 (2006.01);

U.S. Cl.

CPC ...

Abstract

This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. This invention also relates to in-mold decoration tape or strip, comprising: a carrier layer; a release layer; a durable layer; and an adhesive layer which comprises an adhesive binder, a polymeric particulate material and an inorganic particulate material.

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