The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2012

Filed:

Mar. 09, 2009
Applicants:

Maki Kato, Fuchu, JP;

Masaki Ohsumi, Yokosuka, JP;

Yoshinori Tagawa, Yokohama, JP;

Kazuhiro Asai, Kawasaki, JP;

Masahiko Kubota, Tokyo, JP;

Tamaki Sato, Kawasaki, JP;

Akihiko Okano, Kawasaki, JP;

Inventors:

Maki Kato, Fuchu, JP;

Masaki Ohsumi, Yokosuka, JP;

Yoshinori Tagawa, Yokohama, JP;

Kazuhiro Asai, Kawasaki, JP;

Masahiko Kubota, Tokyo, JP;

Tamaki Sato, Kawasaki, JP;

Akihiko Okano, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/76 (2006.01); B23P 17/00 (2006.01); B41J 2/135 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a liquid ejection head includes forming on a substrate a first flow passage wall forming member contacting a solid layer of equal height, exposing a first layer of a negative photosensitive resin material to form an ejection outlet forming member; exposing a second layer, on the first layer, of a negative photosensitive resin material to form a second flow passage wall forming member for forming another part of the wall of the flow passage; placing the exposed first and second layers on the solid layer and the first flow passage wall forming member so that a non-exposed portion of the second layer contacts the solid layer; forming parts of the flow passage and the ejection outlet by removing non-exposed portions of the first and second layers above the substrate; and forming the flow passage by removing the solid layer.


Find Patent Forward Citations

Loading…