The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Apr. 14, 2010
Ryohei Kurosawa, Tokyo, JP;
Kei Hirai, Tokyo, JP;
Ryohei Kurosawa, Tokyo, JP;
Kei Hirai, Tokyo, JP;
Kurosawa Construction Co., Ltd., Tokyo, JP;
Abstract
A PC strand is untwisted to separate surrounding wires from a core wire, a synthetic resin powdered coating material is uniformly adhered by being applied and heated over the outer periphery of the core wire and surrounding wires in this untwisted state, the product is cooled to form a resin film, and then the surrounding wires are twisted back to the original state with respect to the core wire. Pre-heating is performed before the coating step and post-heating is performed after the coating step, the pre-heating temperature is set 30 to 130° C. higher than the post-heating temperature, a synthetic resin powdered coating material having an average grain size of 40 to 50 μm is used, and the process line speed is 5 to 10 m/min.