The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2012

Filed:

Dec. 17, 2009
Applicants:

Wataru Nakahori, Tokyo, JP;

Masaki Kan, Tokyo, JP;

Atsushi Yakuwa, Tokyo, JP;

Inventors:

Wataru Nakahori, Tokyo, JP;

Masaki Kan, Tokyo, JP;

Atsushi Yakuwa, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/26 (2006.01); H01F 27/30 (2006.01); H02M 3/00 (2006.01); H02M 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structurecomprises a first coil substratehaving a primary transformer coil part; a second coil substrate, disposed on the first coil substrate, having a secondary transformer coil part; and a transformer corefor magnetically connecting the transformer coil partsto each other. The coil substratesare disposed on each other while being shifted from each other such that the transformer coil partsoverlap each other as seen in the substrate thickness direction. This can increase the heat dissipation area of the coil substrates. The transformer coil partshave a width in a transmission direction A narrower than a width in a direction B intersecting the transmission direction A as seen in the substrate thickness direction. This can reduce the multilayer area of the coil substratesin the transmission direction A.


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