The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2012

Filed:

Jul. 06, 2010
Applicants:

Chan-wook Baik, Yongin-si, KR;

Seog-woo Hong, Yongin-si, KR;

Hwan-soo Suh, Gunpo-si, KR;

Inventors:

Chan-wook Baik, Yongin-si, KR;

Seog-woo Hong, Yongin-si, KR;

Hwan-soo Suh, Gunpo-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 7/06 (2006.01); H03B 5/18 (2006.01); H03B 7/12 (2006.01); H03B 7/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a microelectromechanical system (MEMS) that includes a first structure and second structure. The first structure and second structure may each include a first substrate and a second substrate. The first substrate of each structure may have first and second surfaces that face each other. The first substrate may include a via etching hole pattern penetrating the first surface and the second surface and a first non-via etching hole pattern penetrating the first surface. The second substrate of each structure may have third and fourth surfaces that face each other. The second substrate may include a second non-via etching hole pattern penetrating the third surface in a position corresponding to the via etching hole pattern of the first substrate. In the microelectromechanical system (MEMS) the second surface of the first substrate and the third surface of the second substrate may be bonded together.


Find Patent Forward Citations

Loading…