The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Sep. 08, 2011
Peter Nelle, Munich, DE;
Matthias Stecher, Munich, DE;
Peter Nelle, Munich, DE;
Matthias Stecher, Munich, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a heat sink plate and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arranged between the semiconductor chip and the heat sink plate. The buffer layer includes a material, which is soft in comparison to a material of the diffusion solder layer, and includes a layer thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during temperature fluctuations within a temperature range.