The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Sep. 28, 2009
Jing Shi, Carlsbad, CA (US);
Hiren D. Thacker, San Diego, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
John E. Cunningham, San Diego, CA (US);
Jing Shi, Carlsbad, CA (US);
Hiren D. Thacker, San Diego, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
John E. Cunningham, San Diego, CA (US);
Oracle America, Inc., Redwood Shores, CA (US);
Abstract
A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.