The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2012

Filed:

Apr. 24, 2009
Applicants:

Suh-yun Feng, Hsinchu, TW;

Chun-kai Liu, Taipei, TW;

Ming-che Hsieh, Kaohsiung, TW;

Chih-kuang Yu, Chiayi, TW;

Inventors:

Suh-Yun Feng, Hsinchu, TW;

Chun-Kai Liu, Taipei, TW;

Ming-Che Hsieh, Kaohsiung, TW;

Chih-Kuang Yu, Chiayi, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers. The second heat-conductive and electrically insulating structure is connected between two adjacent second conductive layers.


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