The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Feb. 02, 2009
Applicants:
Masashi Yagi, Tokyo, JP;
Hirao Hirata, Tokyo, JP;
Shinichi Mukoyama, Tokyo, JP;
Yuh Shiohara, Tokyo, JP;
Inventors:
Masashi Yagi, Tokyo, JP;
Hirao Hirata, Tokyo, JP;
Shinichi Mukoyama, Tokyo, JP;
Yuh Shiohara, Tokyo, JP;
Assignees:
The Furukawa Electric Co., Ltd., Tokyo, JP;
International Superconductivity Center, The Juridical Foundation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/06 (2006.01); H01B 13/00 (2006.01); H01F 6/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A thin film superconductive wire material () and an electro conductive tape () are immersed in a solder bath () containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material () and the electro conductive tape () and a composite superconductive wire material () is formed.