The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Mar. 12, 2008
Koujiro Kameyama, Ota, JP;
Koujiro Kameyama, Ota, JP;
SANYO Semiconductor Co., Ltd., Gunma, JP;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
When a thin semiconductor device is formed by grinding a wafer, it has been necessary to dice the wafer into dies and process the back surfaces of the dies separately. In the invention, a waferis half-diced from the front surface thereof to form groove portionstherein, and in this state, the front surface of the waferis attached to a supporting bodyhaving rigidity with an adhesive layerThen, the waferis ground from the back surface and diced into individual diesand then a back surface process including a heat treatment such as the formation of back surface electrodesis performed in the state where the diesare attached to the supporting body