The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Sep. 27, 2010
Applicants:
Sang-min Lee, Changwon, KR;
Deok-heung Kim, Changwon, KR;
Doc-hwa NA, Changwon, KR;
Inventors:
Assignee:
Samsung Techwin Co., Ltd., Changwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract
A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.
Lee, Sang-min. (2012). Method of manufacturing a circuit board (U.S. Patent No. 8186043). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8186043
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile