The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Jun. 15, 2007
Applicant:

Henry A. Bonges, Iii, Milton, VT (US);

Inventor:

Henry A. Bonges, III, Milton, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

Improving semiconductor chip yield and reliability by connecting adjacent metal traces that are on a same network with metal shorts. This reduces and/or eliminates the need for redundant vias formerly employed in semiconductor chip design. Additionally, the metal shorts are placed in conformance with one or more pre-determined design rules. Once placed, the metal shorts are checked to ensure that each metal short connects groundrule clean, thereby ensuring the placement is correct-by-construction.


Find Patent Forward Citations

Bonges, III, Henry. (2012). System and method to improve chip yield, reliability and performance (U.S. Patent No. 8185859). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8185859

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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