The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Aug. 22, 2002
Applicants:

Michael L. Miller, Cedar Park, TX (US);

Christopher A. Bode, Austin, TX (US);

Inventors:

Michael L. Miller, Cedar Park, TX (US);

Christopher A. Bode, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 19/00 (2011.01);
U.S. Cl.
CPC ...
Abstract

A method includes providing a set of initial characteristic values associated with the semiconductor device. A first fabrication process is performed on the semiconductor device. Fabrication data associated with the first fabrication process is collected. At least one of the initial characteristic values is replaced with the fabrication data collected for the first fabrication process to generate a first modified set of characteristic values. A first value for at least one electrical characteristic of the semiconductor device is predicted based on the modified set of characteristic values. A system includes a first process tool, a first data collection unit, and a prediction unit. The first process tool is configured to perform a first fabrication process on the semiconductor device. The first data collection unit is configured to collect fabrication data associated with the first fabrication process. The prediction unit is configured to provide a set of initial characteristic values associated with the semiconductor device, replace at least one of the initial characteristic values with the fabrication data collected for the first fabrication process to generate a first modified set of characteristic values, and predict a first value for at least one electrical characteristic of the semiconductor device based on the modified set of characteristic values.


Find Patent Forward Citations

Loading…