The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Apr. 16, 2009
Applicants:

Byoung Hwa Lee, Gyunggi-do, KR;

Sung Kwon WI, Seoul, KR;

Hong Yeon Cho, Gyunggi-do, KR;

Dong Seok Park, Seoul, KR;

Sang Soo Park, Gyunggi-do, KR;

Min Cheol Park, Gyunggi-do, KR;

Inventors:

Byoung Hwa Lee, Gyunggi-do, KR;

Sung Kwon Wi, Seoul, KR;

Hong Yeon Cho, Gyunggi-do, KR;

Dong Seok Park, Seoul, KR;

Sang Soo Park, Gyunggi-do, KR;

Min Cheol Park, Gyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.


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