The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
May. 01, 2009
Daniel Sekowski, Lafayette, IN (US);
Frederick Lloyd Carpenter, Conyers, GA (US);
Mark Anthony Hand, Convington, GA (US);
Bernhard Bachl, Regensburg, DE;
Bernd Bienek, Oberhausen, DE;
Olaf Cladders, Kamp-Lintfort, DE;
Henning Dieker, Meerbusch, DE;
Christian Miesner, Toenisvorst, DE;
Lothar Schopmann, Kamp-Lintfort, DE;
Herfried Zimmer, Oberhausen, DE;
Daniel Sekowski, Lafayette, IN (US);
Frederick Lloyd Carpenter, Conyers, GA (US);
Mark Anthony Hand, Convington, GA (US);
Bernhard Bachl, Regensburg, DE;
Bernd Bienek, Oberhausen, DE;
Olaf Cladders, Kamp-Lintfort, DE;
Henning Dieker, Meerbusch, DE;
Christian Miesner, Toenisvorst, DE;
Lothar Schopmann, Kamp-Lintfort, DE;
Herfried Zimmer, Oberhausen, DE;
ABL IP Holding LLC, Conyers, GA (US);
Abstract
In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.