The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Sep. 27, 2007
Isao Nakazato, Kumagaya, JP;
Isao Nakazato, Kumagaya, JP;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
Provided is a thin semiconductor device using a thin metal wire and having a low top portion. The semiconductor device of the present invention has a structure in which a bonding padof a semiconductor chipand an electrodeB are connected to each other via a thin metal wire, and the thin metal wireforms a curve portion. Specifically, the thin metal wireexhibits the curve portionfrom a first bond, and is provided with a linear second extending portionwith an end portion thereof being a first bend portion. A second bend portionis located lower than a top portionof the curve portion
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile