The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Jul. 25, 2011
Ryoichi Kajiwara, Hitachi, JP;
Masahiro Koizumi, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Kazuya Takahashi, Hitachinaka, JP;
Munehisa Kishimoto, Kamakura, JP;
Shigeru Ishii, Tomiya-machi, JP;
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Nishiyokote-machi, JP;
Toshiyuki Hata, Maebashi, JP;
Hiroshi Sato, Takasaki, JP;
Keiichi Ookawa, Takasaki, JP;
Ryoichi Kajiwara, Hitachi, JP;
Masahiro Koizumi, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Kazuya Takahashi, Hitachinaka, JP;
Munehisa Kishimoto, Kamakura, JP;
Shigeru Ishii, Tomiya-machi, JP;
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Nishiyokote-machi, JP;
Toshiyuki Hata, Maebashi, JP;
Hiroshi Sato, Takasaki, JP;
Keiichi Ookawa, Takasaki, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Hitachi Tohbu Semiconductor, Ltd., Gunma, JP;
Abstract
A semiconductor device features a semiconductor chip including a MOSFET, a first electrode of the MOSFET disposed on an obverse surface of the chip, a second, control electrode of the MOSFET disposed on the obverse surface, a third electrode of the MOSFET disposed on a second, opposing surface of the chip, first, second, and third conductive members, each having top surface and opposing bottom surface, the first, second, and third conductive members connecting with the first, second, and third electrodes electrically, respectively, a sealing body having top and bottom surfaces and sealing parts of the first, second, and third conductive members, the first conductive member having first, second, and third contiguous portions, the first portion is positioned over the first electrode, the second is positioned between the first and second portions and the third portion is positioned under the obverse surface of the chip.