The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Oct. 16, 2009
Applicants:

Robert J. Drost, Los Altos, CA (US);

Robert D. Hopkins, Hayward, CA (US);

Alex Chow, Palo Alto, CA (US);

Inventors:

Robert J. Drost, Los Altos, CA (US);

Robert D. Hopkins, Hayward, CA (US);

Alex Chow, Palo Alto, CA (US);

Assignee:

Oracle America, Inc., Redwood Shores, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01); H01L 29/74 (2006.01); H01L 31/111 (2006.01); H01L 29/73 (2006.01); H01L 23/62 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor die is described. This semiconductor die includes an electro-static discharge (ESD) device with a metal component coupled to an input-output (I/O) pad, and coupled to a ground voltage via a signal line. Moreover, adjacent edges of the metal component and the I/O pad are separated by a spacing that defines an ESD gap. When a field-emission or ionization current flows across the ESD gap, the metal component provides a discharge path to the ground voltage for transient ESD signals. Furthermore, the ESD gap is at least partially enclosed so that there is gas in the ESD gap.


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