The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Oct. 01, 2009
Suk Ho Jung, Gyunggi-do, KR;
Hyung Kun Kim, Gyunggi-do, KR;
Hak Hwan Kim, Gyunggi-do, KR;
Young Jin Lee, Seoul, KR;
Ho Sun Paek, Gyunggi-do, KR;
Suk Ho Jung, Gyunggi-do, KR;
Hyung Kun Kim, Gyunggi-do, KR;
Hak Hwan Kim, Gyunggi-do, KR;
Young Jin Lee, Seoul, KR;
Ho Sun Paek, Gyunggi-do, KR;
Samsung LED Co., Ltd., Gyunggi-Do, KR;
Abstract
An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.