The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8183468 B1

PDF
Full Text
Expired
Date of Patent:
May. 22, 2012

Filed:

Jul. 08, 2008
Applicants:

Han Kim, Yongin-si, KR;

Dae-hyun Park, Ulsan, KR;

Inventors:

Han Kim, Yongin-si, KR;

Dae-Hyun Park, Ulsan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer.


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Kim, Han. (2012). Electromagnetic bandgap structure, printed circuit board comprising this and method thereof (U.S. Patent No. 8183468). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8183468

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