The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Oct. 08, 2009
Shinya Suzuki, Kasugai, JP;
Kenichi Saita, Komaki, JP;
Shinya Miyamoto, Konan, JP;
Shinji Yuri, Kasugai, JP;
Shinya Suzuki, Kasugai, JP;
Kenichi Saita, Komaki, JP;
Shinya Miyamoto, Konan, JP;
Shinji Yuri, Kasugai, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A component built-in wiring substrate () which includes: a core substrate (); a plate-shaped component (); a resin filling portion (); and a wiring stacking portion (), wherein, when viewed from the core principal surface () side, the projected area of the mounting area () is larger than the projected area of the plate-shaped component () and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (), and wherein a value of the coefficient of thermal expansion (CTE α) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.