The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Apr. 18, 2008
Applicants:
Tohru Yamakami, Shinagawa, JP;
Osamu Daikuhara, Shinagawa, JP;
Inventors:
Tohru Yamakami, Shinagawa, JP;
Osamu Daikuhara, Shinagawa, JP;
Assignee:
Fujitsu Component Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion.