The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Oct. 22, 2008
Georg Stoppelmann, Bonaduz, CH;
Georg Stoppelmann, Bonaduz, CH;
EMS-Patent AG, Domat/EMS, CH;
Abstract
The invention relates to a polyamide molding compound consisting of the following constituents: (A) between 25 and 70 wt. % of an aliphatic polyamide selected from the group PA1010, PA1012, PA1014, PA1210, PA1212, PA1214, PA12 and PA11, or a mixture of at least two of said systems; (B) between 8 and 35 wt. % of a transparent polyamide selected from the group MACM9-36, MACM9-36/PACM9-36, MACMI/12, MACMI/MACMT/12, or a mixture of at least two of said systems; (C) between 10 and 60 wt. % of reinforcing materials; (D) between 0 and 30 wt. % of particulate and/or layered filling materials; and (E) between 0 and 5 wt. % of auxiliary materials and/or additives, the sum of the constituents (A)-(E) amounting to 100 wt. %. Fibers are used at least partially as reinforcing materials (C), the cross-sectional surface of the fibers being either circular or the dimensional ratio of the main cross-sectional axis to the secondary cross-sectional axis being below 2. The invention also relates to uses of such a polyamide molding compound and components at least partially produced using such a polyamide molding compound.