The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Feb. 14, 2011
Osamu Koike, Tokyo, JP;
Osamu Koike, Tokyo, JP;
Oki Semiconductor Co., Ltd., Tokyo, JP;
Abstract
A method of fabricating a semiconductor device includes: forming a semiconductor chip portion having an electrode on a main surface of a wafer; forming a first resist pattern having a first opening on the electrode; filling the first opening with a first electrically conductive material, thereby forming an electrically conductive post; removing the first resist pattern after said forming of the electrically conductive post; forming an interlayer dielectric film having a second opening positioned on the electrically conductive post; and forming an electrically conductive redistribution layer extending from an upper surface of the electrically conductive post over an upper surface of the interlayer dielectric film.