The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Mar. 26, 2010
Naoko Yoshida, Ibaraki, JP;
Takashi Oda, Ibaraki, JP;
Shigenori Morita, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki-shi, JP;
Abstract
A wiring circuit layerhaving at least a wiring part and an insulating part, whose top and bottom surfaces (A,B) is adhesive surfaces, is formed on a metal support substratein a way such that the layercan be peeled from the substrate. Exposed in the first adhesive surfaceA of the wiring circuit layeris a first connecting conductor part, which is connectable with an electrodeof a first semiconductor elementin a wafer state. After the wiring circuit layeris laminated on and connected to the element, the metal support substrateis peeled from the wiring circuit layerto yield a semiconductor device. Another element may be connected to the other adhesive surfaceB exposed upon the peeling.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile