The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Feb. 27, 2007
Applicants:

Koki Tanaka, Futtsu, JP;

Youichi Ikematsu, Futtsu, JP;

Hiroshi Kihira, Futtsu, JP;

Michio Kaneko, Futtsu, JP;

Wataru Hisada, Kitanagoya, JP;

Tamotsu Itoh, Kitanagoya, JP;

Inventors:

Koki Tanaka, Futtsu, JP;

Youichi Ikematsu, Futtsu, JP;

Hiroshi Kihira, Futtsu, JP;

Michio Kaneko, Futtsu, JP;

Wataru Hisada, Kitanagoya, JP;

Tamotsu Itoh, Kitanagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 8/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a separator for a solid polymer type fuel cell superior in low contact resistance of the fuel cell separator surface with carbon paper and flatness and a method of production of the same, that is, a separator for a solid polymer type fuel cell comprising a substrate of stainless steel or titanium or a titanium alloy having a surface layer part on which conductive compound particles are fixed, wherein said conductive compound particles are comprised of one or more types of metal borides, metal carbides, and metal nitrides with an average particle size of 0.01 to 20 μm, said conductive compound particles are present in a region from said substrate surface to a depth of 10 μm, and a distribution of concentration of the metal element forming the conductive compound in said region satisfies relations between a concentration C of the metal element forming the conductive compound and a depth x from the substrate surface shown by equation <1> (C=A·exp(−x/t)+B) and equation <2> (10≦A≦90, −4.0≦B≦1.0, 0.5≦t≦4.0).


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