The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Apr. 21, 2009
Applicants:

Naomichi Ohashi, Hyogo, JP;

Hidenori Miyakawa, Osaka, JP;

Atsushi Yamaguchi, Osaka, JP;

Arata Kishi, Osaka, JP;

Takayuki Higuchi, Osaka, JP;

Inventors:

Naomichi Ohashi, Hyogo, JP;

Hidenori Miyakawa, Osaka, JP;

Atsushi Yamaguchi, Osaka, JP;

Arata Kishi, Osaka, JP;

Takayuki Higuchi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.


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