The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Dec. 01, 2009
Applicants:

Yueh-chuan Huang, Hsinchu County, TW;

Chyi-ming Leu, Hsinchu County, TW;

Tien-shou Shieh, Taipei, TW;

Chi-fu Tseng, Taipei, TW;

Inventors:

Yueh-Chuan Huang, Hsinchu County, TW;

Chyi-Ming Leu, Hsinchu County, TW;

Tien-Shou Shieh, Taipei, TW;

Chi-Fu Tseng, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 33/00 (2006.01); B32B 7/02 (2006.01); B05D 5/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.


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