The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Mar. 10, 2009
Toshikazu Harada, Kariya, JP;
Koji Kondo, Toyohashi, JP;
Atusi Sakaida, Nagoya, JP;
Toshihisa Taniguchi, Handa, JP;
Keiji Okamoto, Kariya, JP;
Toshikazu Harada, Kariya, JP;
Koji Kondo, Toyohashi, JP;
Atusi Sakaida, Nagoya, JP;
Toshihisa Taniguchi, Handa, JP;
Keiji Okamoto, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.