The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Aug. 20, 2007
Kenneth W. Brown, Yucaipa, CA (US);
Andrew Kent Brown, Victorville, CA (US);
William Earl Dolash, Montclair, CA (US);
Darin Michael Gritters, Calimesa, CA (US);
Thomas Lee Obert, Claremont, CA (US);
Michael John Sotelo, Chino, CA (US);
Kenneth W. Brown, Yucaipa, CA (US);
Andrew Kent Brown, Victorville, CA (US);
William Earl Dolash, Montclair, CA (US);
Darin Michael Gritters, Calimesa, CA (US);
Thomas Lee Obert, Claremont, CA (US);
Michael John Sotelo, Chino, CA (US);
Raytheon Company, Waltham, MA (US);
Abstract
A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.