The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2012

Filed:

Dec. 23, 2009
Applicants:

Nobuo Hara, Osaka, JP;

Yohei Takechi, Osaka, JP;

Yutaka Omori, Osaka, JP;

Inventors:

Nobuo Hara, Osaka, JP;

Yohei Takechi, Osaka, JP;

Yutaka Omori, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to an ultrasonic stress measurement method of measuring a residual stress of a measuring target layer in a measuring object using an ultrasonic wave, the method comprising, setting a plurality of vibration modes according to a number of degree of freedom of the measuring target layer in the measuring object, performing, for each vibration mode, a measurement operation of emitting an ultrasonic wave corresponding to the set vibration mode to the measuring target layer, receiving the ultrasonic wave reflected by the measuring target layer, and measuring an eigenfrequency of the measuring target layer, and measuring the residual stress of the measuring target layer based on plural measurement data of the eigenfrequency with respect to each vibration mode obtained by the measurement operation. The residual stress of the measuring object thus can be measured at higher accuracy.


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