The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2012

Filed:

Apr. 21, 2008
Applicants:

Akihiko Aoyagi, Kanagawa, JP;

Teruhiro Nakamiya, Kanagawa, JP;

Takashi Kouno, Ibaraki, JP;

Hitoshi Shindo, San Jose, CA (US);

Tetsuya Nakatsuka, Kanagawa, JP;

Inventors:

Akihiko Aoyagi, Kanagawa, JP;

Teruhiro Nakamiya, Kanagawa, JP;

Takashi Kouno, Ibaraki, JP;

Hitoshi Shindo, San Jose, CA (US);

Tetsuya Nakatsuka, Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 33/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention help to achieve a solder joining structure having high reliability, in which even if a componential material of a flange of a feed-through of a sealed magnetic disk drive is an iron-based material such as Kovar™, and a componential material of a base of the drive is an aluminum-based alloy, leakage of low-density gas is dramatically reduced. According to one embodiment, a base has a stepped portion in the inside of a periphery of an opening, and an inclined surface extending to the outside of the base is formed at an edge of a surface of the stepped portion, on which a flange of a feed-through is placed, thereby when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed not only in the inside of the base, but also in the outside thereof.


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