The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8179323 B1

PDF
Full Text
Expired
Date of Patent:
May. 15, 2012

Filed:

Dec. 18, 2008
Applicants:

Jeffrey Shamblin, San Marcos, CA (US);

Laurent Desclos, San Diego, CA (US);

Mark Krier, San Diego, CA (US);

Inventors:

Jeffrey Shamblin, San Marcos, CA (US);

Laurent Desclos, San Diego, CA (US);

Mark Krier, San Diego, CA (US);

Assignee:

Ethertronics, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conductive layer is applied to a thermoformed plastic component to form an integrated antenna assembly. The conductive layer is on a flexible layer and adhered or attached to the rigid thermoformed plastic carrier. Features are designed into the thermoformed plastic carrier to provide electrical contacts from the conductive layer to the circuit board of the communication device and to mechanically attach the carrier to the circuit board. Multiple conductive layers can be applied to a multi-layered thermoformed structure to form a multi-antenna assembly.


Find Patent Forward Citations

Shamblin, Jeffrey. (2012). Low cost integrated antenna assembly and methods for fabrication thereof (U.S. Patent No. 8179323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8179323

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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