The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Mar. 31, 2008
Hajime Sasaki, Soraku-gun, JP;
Kazuki Hayata, Soraku-gun, JP;
Hajime Sasaki, Soraku-gun, JP;
Kazuki Hayata, Soraku-gun, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
The invention relates to a high-frequency circuit board that can efficiently radiate heat generated in a mounted electronic component without reducing the degree of freedom in design, a high-frequency circuit module including the high-frequency circuit board, and a radar apparatus including the high-frequency circuit module. A dielectric substrate () includes a mounting portion () that is disposed on one surface () of the dielectric substrate () and on which an electronic component () is to be mounted, and a waveguide () that is formed in the dielectric substrate (). The mounting portion () and the waveguide () are connected with each other through a heat conductor () having a thermal conductivity higher than that of the dielectric substrate ().