The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2012

Filed:

Oct. 15, 2009
Applicants:

Peter Alan Levine, West Windsor, NJ (US);

Pradyumna Kumar Swain, Princeton, NJ (US);

Mahalingam Bhaskaran, Princeton, NJ (US);

Inventors:

Peter Alan Levine, West Windsor, NJ (US);

Pradyumna Kumar Swain, Princeton, NJ (US);

Mahalingam Bhaskaran, Princeton, NJ (US);

Assignee:

SRI International, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/062 (2006.01); H01L 31/113 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate is disclosed. The substrate includes an insulator layer and an epitaxial layer overlying the insulator layer. A bond pad region is formed extending into the epitaxial layer to a surface of the insulator layer. A bond pad is fabricated partially overlying the bond pad region. At least one imaging component is fabricated partially overlying and extending into the epitaxial layer. A passivation layer is fabricated overlying the epitaxial layer, the bond pad, and the at least one imaging component. A handle wafer is bonded to the passivation layer. A portion of the insulator layer and a portion of the bond pad region is etched to expose a portion of the bond pad.


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