The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Apr. 26, 2006
Patrice Gamand, Douvres la Delivrande, FR;
Jean-marc Yannou, Colomby sur Thaon, FR;
Fabrice Verjus, Creully, FR;
Cyrille Cathelin, Caen, FR;
Patrice Gamand, Douvres la Delivrande, FR;
Jean-Marc Yannou, Colomby sur Thaon, FR;
Fabrice Verjus, Creully, FR;
Cyrille Cathelin, Caen, FR;
ST-Ericsson SA, Geneva, CH;
Abstract
An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ) of a printed circuit board (PCB), and a passive integration substrate (S) set on top of the digital and/or analog integrated circuit (S) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.