The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Sep. 28, 2006
Applicants:
Stephan Lutgen, Regensburg, DE;
Tony Albrecht, Bad Abbach, DE;
Wolfgang Reill, Pentling, DE;
Inventors:
Assignee:
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for production of a plurality of semiconductor chips () in a wafer composite. A semiconductor layer sequence () is grown on a growth substrate (), metallization () is applied to the semiconductor layer sequence (), a metal layer () is electrochemically deposited onto the metallization (), and the semiconductor layer sequence () is then structured and separated to form individual semiconductor chips (). The electrochemically applied metal layer () is particularly suitable for use as a heat spreader, for dissipation of the heat produced by the semiconductor chips ().