The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Jun. 08, 2010
Koji Hiraiwa, Tokyo, JP;
Takeo Kageyama, Tokyo, JP;
Norihiro Iwai, Tokyo, JP;
Keishi Takaki, Tokyo, JP;
Koji Hiraiwa, Tokyo, JP;
Takeo Kageyama, Tokyo, JP;
Norihiro Iwai, Tokyo, JP;
Keishi Takaki, Tokyo, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane with a pitch same as that of the surface-emitting laser devices being electrically connected to each other to have contact with pad electrodes of the surface-emitting laser devices, respectively, and applying a current to second electrodes of the surface-emitting laser devices and the contact electrodes. The wafer level burn-in test is performed while heating the wafer at a predetermined temperature. Laser lights emitted from the surface-emitting laser devices are monitored during the wafer level burn-in test.