The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Nov. 16, 2007
Atsushi Oda, Yamagata, JP;
Toshiro Kobayashi, Hiroshima, JP;
Keiichi Sato, Hiroshima, JP;
Hiroko Kitamoto, Hiroshima, JP;
Susumu Kamikawa, Hiroshima, JP;
Kozo Wada, Hiroshima, JP;
Atsushi Oda, Yamagata, JP;
Toshiro Kobayashi, Hiroshima, JP;
Keiichi Sato, Hiroshima, JP;
Hiroko Kitamoto, Hiroshima, JP;
Susumu Kamikawa, Hiroshima, JP;
Kozo Wada, Hiroshima, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
An evaporation source having a nozzle structure that makes the distribution of film thickness uniform in the width direction of a substrate and a vacuum evaporator using the same are provided. A vapor produced by evaporation or sublimation by heating to evaporation material is discharged from a long nozzle opening like a band. A deposited substrate is transferred in a direction perpendicular to the longitudinal direction of the nozzle opening while facing the nozzle opening. A discharge flow rate of vapor per unit area in the longitudinal direction of the nozzle opening is made to be maximum in a portion at a nozzle width direction position corresponding to a substrate edge position rather than a central part of the nozzle opening and a plurality of partition plates providing directivity to the flow of vapor are arranged inside the nozzle opening.