The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8176966 B1

PDF
Full Text
Expired
Date of Patent:
May. 15, 2012

Filed:

Nov. 28, 2008
Applicants:

Hirokazu Yoshida, Tokyo, JP;

Tsukasa Takazawa, Tokyo, JP;

Toshio Abe, Tokyo, JP;

Shuji Tomimatsu, Tokyo, JP;

Inventors:

Hirokazu Yoshida, Tokyo, JP;

Tsukasa Takazawa, Tokyo, JP;

Toshio Abe, Tokyo, JP;

Shuji Tomimatsu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.


Find Patent Forward Citations

Yoshida, Hirokazu. (2012). Process and equipment for producing copper alloy material (U.S. Patent No. 8176966). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8176966

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…