The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2012

Filed:

May. 06, 2008
Applicants:

Nathan P. Lower, North Liberty, IA (US);

Ross K. Wilcoxon, Cedar Rapids, IA (US);

Qizhou Yao, Coralville, IA (US);

David W. Dlouhy, Cedar Rapids, IA (US);

John A. Chihak, Hiawatha, IA (US);

Inventors:

Nathan P. Lower, North Liberty, IA (US);

Ross K. Wilcoxon, Cedar Rapids, IA (US);

Qizhou Yao, Coralville, IA (US);

David W. Dlouhy, Cedar Rapids, IA (US);

John A. Chihak, Hiawatha, IA (US);

Assignee:

Rockwell Collins, Inc., Cedar Rapis, IA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.


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