The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Dec. 10, 2008
Sung Ryul Kim, Cheonan-si, KR;
Yong-mo Choi, Osan-si, KR;
Sung-hoon Yang, Seoul, KR;
Hwa-yeul OH, Seoul, KR;
Kap-soo Yoon, Seoul, KR;
Jae-ho Choi, Seoul, KR;
Seong-hun Kim, Seoul, KR;
Sung Ryul Kim, Cheonan-si, KR;
Yong-Mo Choi, Osan-si, KR;
Sung-Hoon Yang, Seoul, KR;
Hwa-Yeul Oh, Seoul, KR;
Kap-Soo Yoon, Seoul, KR;
Jae-Ho Choi, Seoul, KR;
Seong-Hun Kim, Seoul, KR;
Abstract
Provided are a metal line, a method of forming the same, and a display using the same. To increase resistance of a metal line having a multilayered structure of CuO/Cu and prevent blister formation, a plasma treatment is performed using a nitrogen-containing gas and a silicon-containing gas or using a hydrogen or argon as and the silicon-containing gas. Accordingly, a plasma treatment layer such as a SiNx or Si layer is thinly formed on the copper layer, thereby preventing an increase in resistance of the copper layer and also preventing blister formation caused by the damage of a copper oxide layer. Consequently, it is possible to improve the reliability of a copper line and thus enhance the reliability of a device.