The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Mar. 24, 2010
Peter Mark O'neill, Fort Collins, CO (US);
Peter Mark O'Neill, Fort Collins, CO (US);
Avago Technologies Enterprise IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
An integrated circuit package comprises a package substrate, an application specific integrated circuit (ASIC) having a first area and formed on a first wafer made from a select semiconductor material, a second wafer of the select semiconductor material, and a supplemental-integrated circuit. The supplemental-integrated circuit has a second area different from the first area. The first wafer includes a through-wafer via to couple the ASIC to the package substrate. An active surface of the ASIC is coupled to the second wafer. The second wafer is arranged with a window there through that is sized to closely receive and align one or more bonding interfaces of the supplemental-integrated circuit to respective bonding interfaces of the ASIC. A corresponding method for assembling a die-stacked integrated circuit package is disclosed.