The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Jun. 21, 2009
Applicants:
Chien-hua Chen, Corvallis, OR (US);
Barry C. Snyder, Bend, OR (US);
Ronald A. Hellekson, Eugene, OR (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Barry C. Snyder, Bend, OR (US);
Ronald A. Hellekson, Eugene, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.
Chen, Chien-Hua. (2012). Bonded structures formed by plasma enhanced bonding (U.S. Patent No. 8174094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8174094
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile