The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2012

Filed:

Mar. 30, 2009
Applicants:

Thomas Heinz-helmut Altebaeumer, Oxford, GB;

Stephen Day, Chipping Norton, GB;

Christian Lang, Oxford, GB;

Jonathan Heffernan, Oxford, GB;

Inventors:

Thomas Heinz-Helmut Altebaeumer, Oxford, GB;

Stephen Day, Chipping Norton, GB;

Christian Lang, Oxford, GB;

Jonathan Heffernan, Oxford, GB;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating a device structure, comprises: forming an insulating layer () over a first set of devices disposed over a substrate (); forming one or more vias in the insulating layer; disposing a second set of devices () over the insulating layer, wherein devices of the second set comprise respective electrical contacts () and are disposed over the insulating layer () such that a side on which a contact () can be accessed faces the substrate (); and forming one or more electrical contacts between the first set of devices and the second set of devices () through the via(s). The second set of devices and at least one via are positioned such that one or more of the vias lies at least partially within the footprint of two devices, each belonging to a different device layer.


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