The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2012

Filed:

Jan. 24, 2011
Applicants:

Tsutomu Sawai, Toyama, JP;

Kazuya Komori, Toyama, JP;

Inventors:

Tsutomu Sawai, Toyama, JP;

Kazuya Komori, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length Lof a weight portionand an additional weight portionas measured in an extending direction of a centerline C is determined to be shorter than a length Lof a support portionas measured in the extending direction of the centerline C. The weight portionand the additional weight portionare received within a spacedefined, being surrounded by the support portion. Then, dimensions and shapes of the weight portionand the additional weight portionare determined to allow the weight portionand the additional weight portionto move within the space


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