The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Sep. 25, 2006
Herve Marie, Caen, FR;
Sofiane Ellouz, Paris, FR;
Herve Marie, Caen, FR;
Sofiane Ellouz, Paris, FR;
NXP B.V., Eindhoven, NL;
Abstract
A wafer comprises i) at least one independent die having internal integrated components, a multiplicity of internal pads connected to some of the internal integrated components, ii) scribe lanes defined between and around each independent die, and in part of which are defined, for each die, at least a first group of external pads and/or a second group of external test integrated components. The external pads of each first group are connected, through conductive tracks, to a chosen one of the internal pads and/or internal integrated components of the associated die, and arranged to be fed with chosen test signals or to collect test result signals. Each external test integrated components of each second group is connected, through conductive tracks, to a chosen one of the die internal pads and/or die internal integrated components and/or to external pads of a first group.