The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2012

Filed:

Feb. 20, 2009
Applicants:

Hidetoshi Kami, Numazu, JP;

Yukio Fujiwara, Numazu, JP;

Kazuhiro Egawa, Numazu, JP;

Inventors:

Hidetoshi Kami, Numazu, JP;

Yukio Fujiwara, Numazu, JP;

Kazuhiro Egawa, Numazu, JP;

Assignee:

Ricoh Company Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 5/047 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image forming apparatus including an image bearing member which has an electroconductive substrate, a photosensitive layer overlying the electroconductive substrate and a cross-linked resin surface layer overlying the photosensitive layer and bears a latent electrostatic image on the surface thereof, an application device to apply a solid lubricant to the image bearing member; a charging device to charge the surface of the image bearing member, an irradiation device to irradiate the surface of the image bearing member with light to form the latent electrostatic image thereon, a development device to develop the latent electrostatic with toner to obtain a developed image, a transfer device to transfer the developed image to a recording medium, and; a cleaning device to clean the surface of the image bearing member, wherein the cross-linked resin surface layer includes a cross-linked body of trimethylol propane triacrylate and particulates including silicon and an average diameter of agglomeration areas of the particulates containing silicon on the surface of the cross-linked resin surface layer is from 0.5 to 2.2 μm.


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