The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2012

Filed:

Sep. 26, 2008
Applicants:

Hideyuki Sakamoto, Gunma, JP;

Hidefumi Saito, Gunma, JP;

Yasuhiro Koike, Gunma, JP;

Masao Tsukizawa, Gunma, JP;

Inventors:

Hideyuki Sakamoto, Gunma, JP;

Hidefumi Saito, Gunma, JP;

Yasuhiro Koike, Gunma, JP;

Masao Tsukizawa, Gunma, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.


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