The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2012

Filed:

Mar. 12, 2009
Applicants:

Tetsuya Takahashi, Kawasaki, JP;

Kenji Kobae, Kawasaki, JP;

Shuichi Takeuchi, Kawasaki, JP;

Yoshiyuki Satoh, Kawasaki, JP;

Hidehiko Kira, Kawasaki, JP;

Takayoshi Matsumura, Kawasaki, JP;

Inventors:

Tetsuya Takahashi, Kawasaki, JP;

Kenji Kobae, Kawasaki, JP;

Shuichi Takeuchi, Kawasaki, JP;

Yoshiyuki Satoh, Kawasaki, JP;

Hidehiko Kira, Kawasaki, JP;

Takayoshi Matsumura, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.


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